Participation of HCCC at the Global Innovation Summit 2026 in Basel

The Hellenic Chips Competence Centre (HCCC), Greece’s national hub for innovation and the development of the semiconductor and microelectronics ecosystem, participated in the Global Innovation Summit, held on 6 May 2026 in Basel, Switzerland, as part of the international Swiss Biotech Day 2026 event.

HCCC was represented by Mr. Giorgos Kotrotsios, Vice President of HCCC, who took part in meetings and networking activities with international innovation stakeholders and organisations, aiming to strengthen the international presence of the Greek semiconductor ecosystem and foster new collaborations.

HCCC’s participation in the Global Innovation Summit aligns with the organisation’s strategy to promote innovation, knowledge transfer, and the connection of the Greek research and business community with the European and global microelectronics and advanced technology ecosystem.

The Global Innovation Summit served as an important platform for the exchange of expertise and the exploration of synergies in areas such as semiconductors, artificial intelligence, advanced digital technologies, and industrial innovation, highlighting the importance of cross-border collaboration in shaping a resilient and competitive European technology ecosystem.

In the context of Greece’s overall presence at the Global Innovation Summit, several key national organisations and innovation bodies also participated, including the HBio – Hellenic Biocluster, the “Athena” Research Center, and GRNET (National Infrastructures for Research and Technology), further strengthening Greece’s representation in research, digital technologies, and industrial innovation.

The participation was organized with the support of the Office for Economic and Commercial Affairs of the Embassy of Greece in Switzerland.

HCCC project is supported by Chips JU and its members, and is co-funded by European Union and the Greek Government via the “Competitiveness” Programme.

Co-funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or EYDE-VEK. Neither the European Union nor the granting authority can be held responsible for them.